APS, LLC., is committed to comply with applicable requirements and continually improve the effectiveness of our Quality Management System to provide Quality parts and services that exceeds our customer expectations.

• 1.- External Visual Inspection: Examination reveals evidence of prior use, secundary coating, socket pulls, retinning, lead reforming, remarking, fraudulent/ counterfeit parts.
• 2.- Dimension Verification: The Measuring testing confirms the manufacturer`s specifications.
• 3.- X-Ray Analisis: Die size, general shape, lead frame construction, wire bonding guage and routing can be checked.
• 4.- Ping Correlation Testing: To detect Gross defects such as opens, shorts, excessive leakage, and ESD damage caused by improper handling or storage.
• 5 .- Functionality Test: Ensure proper device operation – acceptable power consumption, basic functionality, and verifies datasheet parameters.
• 6.- Solderability Test: Reveals evidence of porosity, voids, coverage and inconsistent wetting.